Game-Boy-chips-decapping-project
A database of microscopic images of decapped chips from Game Boy cartridges.
The silicon dies were extracted from epoxy matrix with 70% nitric acid heated at 250Β°C. The mineral carbon residuals were removed with nitro-chromic acid at 200-250Β°C. After rincing with deionized water, dies were finally gently cleaned with isopropanol and a nonwoven cotton fabric to remove any dust before imaging with professionnal equipment.
I definitely do not recommend doing the process if you are not a skilled chemist with access to all necessary safety equipment (fumehood and individual protection against strong acids).
Images were taken with a magnification of x250 by default (may be more to reveal some details).
For more detailed images, download the full resolution images repositery.
Game Boy Camera MAC-GBD
Datecode 9815, Camera CE10251329, PCB revision 11